Magillem at CSIA-ICCAD 2017

CSIA-ICCAD 2017, Annual Conference & Beijing IC industry Innovation and Development Summit, in November 16-17, 2017 at Daoxianghu, Haidian District, Beijing, China (Booth #49)

Magillem is pleased to welcome you on booth #49, during the CSIA-ICCAD 2017, held from 16th to 17th November, at Daoxianghu, Haidian District, Beijing, China.

Organized by Zhongguancun IC Design Park, the main topic of this annual conference is “Driven by Innovations, Lead the Development”. The Integrated Circuit industry, especially the opportunities and challenges faced by the IC Design industry, will be discussed in details in order to enhance innovation capability and improve the comprehensive capability of Chinese Integrated Circuit industrial chain, thereby satisfying the market demands and boosting international competence.

Magillem will show to attendees its methodology and solutions that drastically reduce the global cost of complex design, help them preserve their independence from vendors and their investment by relying on a worldwide adopted formats like IP-XACT (IEEE 1685).
Our innovative solution, called ISDD – Integrated Specification, Design and Documentation, introducing a XLM-based collaborative platform, supports customers’ R&D from specification of their product to the documentation, and connects all business experts, especially in embedded systems’ domain.

We look forward to your visit on our booth #49

To schedule a meeting

Please email us your request at

Contacts :
■ David DE PAULA :
■ Julian HU :

Posted in Events, News.